Dynex Awarded €1 million R&D Grant from EU


Part of Collaborative European Project to Deliver Advances in Power Converters for Aircraft Applications

Lincoln, England, September 28th, 2015 – Dynex Power Inc., a leading specialist high power semiconductor company, today announced that its subsidiary, Dynex Semiconductor Ltd, had been awarded grants totaling  €1 million by the European Union’s Horizon 2020 Research and Innovation Programme to develop the next generation of electronic components for use in aircraft.

The grant will fund Dynex’s costs as a partner in a three year, €7 million project being coordinated by Siemens AG. The project, known as the Integrated, Intelligent Modular Power Electronic Converter Project (or I2MPECT for short) is being carried out by a pan European consortium of nine organizations and is designed to provide significant advances in the state of the art in power converters for aircraft applications thus improving the competiveness of European aviation through cost efficiency and innovation.

Dynex’s contribution to the project will be to deliver innovative 3D power semiconductor device packaging based on planar interconnect technologies with double-sided integrated cooling for wide band-gap wire-bond free power semiconductor devices.

Dr Steve Jones, IGBT Module Technology Manager and Dynex Project Leader for the I2MPECT Project commented “We are delighted by this award. Dynex has significant technological strengths in IGBT and power module packaging and we see this project as an exciting opportunity to extend our technology into the aviation sector”. Dr Jones continued, “This grant follows on from our success last year in winning a grant from the Technology Strategy Board, the UK’s innovation agency, to work in a consortium with Cummins to develop IGBT power module packages for automotive applications”.

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 636170.

About the Company
Dynex designs and manufactures high power bipolar semiconductors, high power insulated gate bipolar transistor (IGBT) modules, high power electronic assemblies and radiation hard silicon-on-sapphire integrated circuits (SOS IC’s). The company’s power products are used worldwide in power electronic applications including electric power transmission and distribution, renewable and distributed energy, marine and rail traction motor drives, aerospace, electric vehicles, industrial automation and controls and power supplies. Our IC products are used in demanding applications in the aerospace industry. Dynex Semiconductor Ltd is its only operating business and is based in Lincoln, England in a facility housing the fully integrated silicon fabrication, assembly and test, sales, design and development operations.  Dynex is majority owned by Zhuzhou CSR Times Electric Co., Ltd.

Zhuzhou CSR Times Electric Co., Ltd. is based in Hunan Province in the People's Republic of China. It is listed on the Hong Kong Stock Exchange. CSR Times Electric is mainly engaged in the research, development, manufacture and sales of locomotive train power converters, control systems and other train-borne electrical systems, as well as the development, manufacturing and sales of urban railway train electrical systems. In addition, CSR Times Electric is also engaged in the design, manufacturing and sales of electric components including power semiconductor devices for the railway industry, urban railway industry and non-railway purposes.

Information about Dynex Semiconductor Ltd and its products can be found at www.dynexsemi.com

Further information on CSR Times Electric can be found at www.timeselectric.cn/en

All monetary values expressed in this release are in Canadian Dollars unless stated otherwise.

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